Up to 82 differential pairs per linear inch. Samtec XCede High Speed / Modular Connectors are available at Mouser Electronics. 1. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 适用于密度关键型应用的小型高密度背板系统，采用模块化设计并提供可选功能，以提升灵活性和实现可定制解决方案。Amphenol XCede HD Series Backplane Connectors are available at Mouser Electronics. XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contact Build your mated connector set using Samtec’s High-Speed Board-to-Board Solutionator®. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Scalable upgrades to 56Gb/s without costly redesigns. XCede ® HD2 § XCede ® and AirMax are excellent and proven board-to-board connectors for backplane, mezzanine, orthogonal, or coplanar solutions up to 25Gb/s. 5-inch backplane 1. Amphenol TCS XCede Backplane Connectors feature up to 82 differential pairs as well as 2-, 3-, 4-, 5-, and 6-pair configurations. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Submit a Brief. com. 1. XCede PRODUCT FAMILY DAUGHTERCARD MODULE REMOVAL AND REPLACEMENT . XCede 85 Ohm for applications where matching lower system impedance is desired and XCede cable. Price request; Print; Specifications. Skip to content. 7mil Drill Minimum Pad Size vs. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. c-jx410-51594 a creo files jx410-51594_bp . The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 1 XCede HD 2 Pair Backplane With Extra Ground Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick WallXCede® HD backplane connector achieves high performance (up to 20Gb/s) in a hard metric form factor. Integrated power, guidance, keying and side walls available. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH VIRTUAL SHIELD TECHNOLOGY AirMax VS ®. 1. 1. Login or REGISTER Hello, {0}. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingThe XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Login or REGISTER Hello, {0}. 2. Amphenol is one of the leading manufacturers of Backplane connectors. Multiple signal/ground pin staging options. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Close Modal. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. SERIES Maximum signal pins Terminal pin orientation Connector Length Type Termination Row REMARKS; HM2A30: 6 Spl: Vertical: 50. 20mm HPTS Power Modules feature press-fit tails, vertical mounts, and come in a variety of body heights to match signal module pair count. TARGET MARKETS. 2. Description Initial Date “A” S2401 Initial Release E. drwXCede ® connectors also address requirements for high linear signal density at the backplane and daughter card interface. XCede Product Family Connector Press-fit Installation Process . Login or REGISTER Hello, {0}. XCede® connectors also address. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH VIRTUAL SHIELD TECHNOLOGY AirMax VS ®. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. 28G ADDITION TO THE XCEDE ® HD FAMILY XCede ® HD plus leverages the same. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The XHD+ DC system will offer two (2) primary guidance systems, (1) the standard guide module receptacle; and (2) the wide guide. FEATURES. 80mm Right-Angle Backplane Receptacle (HDTF) From: £2. Login or REGISTER Hello, {0}. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. Aug 25, 2011XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. We offer interconnection systems from 2. 80mm Right-Angle Backplane Receptacle; HDTF-6-08-S-RA-LC-100; HDTF - Samtec XCede® HD 1. Login or REGISTER Hello, {0}. Select language:Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. $ 129. 1. 54mm pitch down to 0. We work with businesses, from pioneering start-ups to global brands, to find project-based or permanent talent that enables innovation in line with their vision and goals. 5 out of 5 stars 3,424. Copper Weight and Annular Ring (“A/R”) 7 Table 2: XCede® HD and XCede® HD Plus 17. They can either add a new cabling solution with backplane components at right angles, or expand their systems horizontally. 4. Check Pricing. The XCede HD interconnect platform also has available RAM (Right Angle Male). XCede HD achieves the highest performance in an HM compatible form factor. 2 The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male Amphenol Communications Solutions XCede high-performance backplane connector system. 三个等级的上电次序实现了热插拔. Mouser offers inventory, pricing, & datasheets for XCede High Speed / Modular Connectors. The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. DETAILS. Typical applications include communications and data such as hubs, switches, routers, wireless infrastructure, servers, external storage systems, and more. Dislaime Please note that the above information is subect to change without notice. 5 - Effective capacity assumes average 4:1 data reduction. EspañolAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1. 00mm pitch (FF5026) and 050mm pitch (FF3025). Multiple signal/ground pin staging options. Samtec XCede® HD 3. 4. 6. 0 DEFINITIONS 4. The XCede ® I/O interconnect system is comprised of a 32 position, variable pitch connector built for use in high speed serial applications. For a 6-pair differential connector per column, 82. 2-, 3-, 4-, 5-, 6-Pair configurations. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. These connectors are two-piece devices that connect two printed circuit boards. Sloan 2-09-09 “A” S1979 Updated procedure, and addition of RAM and Stacker M. 2 The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male Figure 20: Example XCede® HD Midplane Connector 20 LIST OF TABLES Table 1: XCede® HD , XCede® HD Plus and XCede® HD2 15. DETAILS. XCede® BACKPLANE CONNECTOR SYSTEM DESCRIPTION XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 12 - 48 pairs. 3. Specs Kit. § Differential pairs 28-84 per inch (11-33 differential pairs per10120130-L0J-20DLF Datasheets | Backplane Connectors - Specialized Connector Header, Male Pins and Blades Through Hole Black XCede®, Left Wall By apogeeweb, 10120130-l0j-20dlf, 10120130-l0j-20dlf datasheet,10120130-l0j-20dlf pdf,amphenol icc (fci)Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 96 and 5. Login or REGISTER Hello, {0}. Login or REGISTER Hello, {0}. XCede® Family Cable Assemblies MATERIAL §§Contacts: High. Complementary guide and power modules are also included in the product range. 54 - 5. 7. 特色. 2. Login or REGISTER Hello, {0}. EN. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. BENEFITS. Login or REGISTER Hello, {0}. 1. for connector repairability. Mouser offers inventory, pricing, & datasheets for Samtec XCede High Speed / Modular Connectors. Connectors in the dataspace can handle unified message exchanges by returning data model-compliant responses to data requests. XCede Connectors are available at Mouser Electronics. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The XCede ® I/O connector supports next generation 100G+ applications and. (1) Notes1: XCede HD RAM and XCede HD Inverted RAM use the same tool of XCede HD Daughter. The XCede ® I/O connector supports next generation 100G+ applications and. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. AMPHENOL COMMUNICATIONS SOLUTIONS. Data rates capable up to 28 Gb/s to support system upgrades without costly redesigns. 2. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Login or REGISTER Hello, {0}. The XCede ® HD Plus backplane connector achieves high . 1. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Connectors; High Speed Board-to-Board; Micro Pitch Board-to-Board; Rugged / Power; Edge Card; Backplane / Micro Backplane; Standard Board-to-Board; Industry Standards;. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 1. § Differential pairs 28-84 per inch (11-33 differential pairs perBack view of 24 x 2. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. Applications. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 1. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 3A per pin current rating and mount individually to the backplane. 7. Login or REGISTER Hello, {0}. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 3-, 4- and 6-pair designs. Random Access Memory, or RAM (pronounced as ramm ), is the physical hardware inside a computer that temporarily stores data, serving as the computer's "working" memory. Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. TARGET MARKETS. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Mouser offers inventory, pricing, & datasheets for XCede High Speed/Modular Connectors. 99 $ 19. The XCede product family encompasses XCede®, XCede Plus®, and X2 product lines, and their corresponding product derivatives including; Daughtercard, backplane, mezzanine,. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. 1 DOCUMENTS 2. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 0217" Drill XCede HD & XCede HD PLUS press fit backplane connector family onto a printed circuit board (PCB). - FCI. 1. Luxshare-TECH Gen-Z provides the full range of configuration: 1C，2C，4C，4C+，8C and HP (. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. English. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 2. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures. XCede® connectors also address. 2-to-PCIE-x4 adapter cable - but it runs $150. TARGET MARKETS. Contact us today for more details of XCede HD, part number 968-4200-A1H. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. The XCede product family encompasses XCede®, XCede Plus®, and X2 product lines, and their corresponding product derivatives including; Daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho), and cable backplane interconnect systems. 7. 1. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. Article: 00028492. Download M12 PCB MOUNT CONNECTOR, X-CODED, FEMALE. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. TB-2023 Amphenol TCS Commercial Connector Qualification Plan TB-2237 XCede HD Routing Guidelines 2. Amphenol is one of the leading manufacturers of Connectors. F X Connectors in Victoria, reviews by real people. Find Parts Learn More. XCede® connectors also address. 2 617-0450-014 xcede hd 4pair stiffener 1 1 922-421f-d3h xcede hd 4pair lc mod w/ organizer, 8pos, 100ohms, bifurcated, . Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets the requirements of high-density architectures with a 35% increase in density as compared to standard XCede®. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Revision “F” Specification Revision Status . Available in industry-standard 2. Please confirm your currency selection:2. See Figure 15 for details. Xcede's first Data Networking Event in Manchester was a great success, and we can't thank the incredible team at Moneysupermarket enough for co-hosting with us at their fantastic Manchester office. TARGET MARKETS. Buy 928-4000-A7H - Amphenol Communications Solutions - Connector, 4 Diff Pair, XCede HD Series, Receptacle, Press Fit. These connectors are available in 3-, 4- and 6-Pair configurations. 0 TOOLING 1. XCede® HD 1. Features. 3. DETAILS. - FCI. 4、6或8列. Article: 00229048. Login or REGISTER Hello, {0}. Search for: Search Home; Categories. XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contactJ-Tech, Inc. XCEDE CONNECTOR ECCN / UNSPSC / COO. Features & Benefits. View Substitutes & Alternatives along with datasheets, stock, pricing and search for other Backplane Connectors products. Integrated power and guidance. XCede® connectors also address requirements for high linear signal density at the backplane. View Substitutes & Alternatives along with datasheets, stock, pricing and search for other Backplane Connectors products. $19. High-speed, high-density backplane systems include ExaMAX ® and XCede ® HD in a variety of pair and column counts. Mouser offers inventory, pricing, & datasheets for XCede High Speed / Modular Connectors. 1. 08mm. No spam. Login or REGISTER Hello, {0}. refer to c-922-4x0a-500 for signal connector detail. Spacone 5-29-12 The XCede® Right-Angle Male (XCede® RAM) connector allows designers to grow their systems horizontally or add a new cabling solution by creating traditional. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Login or REGISTER Hello, {0}. EIA-364-B Electrical Connector Test Procedure Including Environmental Classifications 2. XCede ® HD is a small form factor system with a modular design for significant space savings and. XCede® connectors also address. The. The XCede ® HD Plus backplane connector achieves high . 4, 6 or 8 columns. Guidance and keying options. 信号端子上可实现高达3. XCede® HD 1. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCedeHD RAM and XCede HD Inverted RAMrefer to. 4. 0A: 250V: EXTreme OrthoPowerНа страницах каталога оборудования вы найдете Connectors: board-to-board различных производителей - большой выбор оборудования и техники. 54mm pitch down to 0. 2. 1 DOCUMENTS 2. Guidance and keying options. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. These modules consist of a 12. It is intended to provide general guidance for development of customer designs It is intended to provide general guidance for development of customer designs and application processes as they relate to this product family. Basics is present with its full range of products to meet the needs of our customers. 4. 2. 6 XCede RAM and Extended RAM 2 Pair Application Tools 694-4528-000 – 2-Pair RAM Loading Head 1. Lukin 08/19/13 “B” S2483 Update Max force per pin spec E. XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Integrated power and guidance. XCede® HD结合了小巧的外形和优异的设计灵活性，实现了电路板和系统空间的大幅节省。系统的模块化使设计师能够借助可选电源模块、导引和锁合以及侧壁来打造出完全定制的背板解决方案，从而提高耐用性。 XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backwards mating interface compatibility with existing XCede products. XCede® connectors also address. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. High Speed / Modular Connectors XCede HD High-Density Backplane Custom Right-Angle Module BSP-226769-01; Samtec; 1: $29. Mechanical longevity and ruggedness. The XCede product family encompasses XCede®, XCede Plus®, and X2 product lines, and their corresponding product derivatives including; Daughtercard, backplane, mezzanine, right- angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho), and cable backplane 1. English. Login or REGISTER Hello, {0}. Features. 7. Figure 14: Typical Force vs. 1. The PCIe bus, NC-SI bus, SMBus interface, various other sideband signals, and power are assigned to this connector. Offering a linear density of up to 84 differential pairs per inch and can. BACKPANEL CONNECTORS BACKPLANE CONNECTOR SYSTEM XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 2. XCede HD & XCede HD PLUS press fit backplane connector family onto a printed circuit board (PCB). 4. power connector (J_PWR_A) 6. Login or REGISTER Hello, {0}. XCede® BACKPLANE CONNECTOR SYSTEM - FCI. Available for SOLIDWORKS, Inventor, Creo, CATIA, Solid Edge, autoCAD, Revit and many more CAD software but also as STEP, STL, IGES, STL, DWG, DXF and more neutral CAD formats. Female pin. 2 Reference Documents TB-2235 XCede HD General Product Specifications TB-2237 XCede HD Routing Guidelines TB-2252 XCede HD Backplane Connector Installation 2. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today’s . 1. Mouser offers inventory, pricing, & datasheets for Amphenol Xcede Series High Speed / Modular Connectors. Jump to a Section. This document describes the methods and tooling for the installation of Amphenol TCS XCede HD,XCede HD PLUS&XCede HD2right angle press-fit daughtercard connectors onto a printed circuit board (PCB). Change LocationAmphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. REPAIR PROCEDURE FOR MODULE SEE TB-2217. See section 4 regarding XHD+ RAM connectors. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. 99. View eCAD Files. High Speed Cables & Connectors; HDTF - Samtec XCede® HD 1. 3. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. Across our key areas, our experts operate with a. Samtec XCede® HD HPTS 3. Samtec XCede® HD 3. XCede connectors also address requirements for higher linear signal density at the backplane or midplane interface. XCede® BACKPLANE CONNECTOR SYSTEM - FCI. 2. My main workstation is based on Ryzen 7 5800X, Asus Crosshair VIII Dark Hero, 64 GB RAM, 1TB Samsung 980 PRO SSD, EVGA RTX 3070ti FTW3 GPU, etc. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling. The inserts can be installed as per the. 3A per pin current rating and mount individually to the backplane. Features. element14 Malaysia offers special pricing, same day dispatch, fast delivery, wide inventory, datasheets & technical support. Xcede Group is a global recruitment organisation that delivers technology and energy talent solutions which enable companies to innovate and grow. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. 2. 1. XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. The series offers mechanical. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. Pin header. Connectors; Diodes & Rectifiers; Embedded Processors & Controllers; Embedded Solutions; EMI/RFI Components; Enclosures;XCede High Speed / Modular Connectors are available at Mouser Electronics. Available in straddle mount, through-hole termination and also SMT. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets requirements of high density architectures with 35% increase in density as compared to standard XCede®. KK connector systems are customizable for a variety of power and signal applications. XCedeHD RAM and XCede HD Inverted RAMrefer to. 5. XCede® Connectors - Amphenol CS | DigiKeyXCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 3、4和6对设计. HDTM. The diagram below, created by NTT DATA based on the IDS-RAM Information Model *3, shows the basis of data model. 3. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Standard or high-speed wafers available. 3. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management. Free shipping on many items | Browse your favorite brands | affordable prices. Pitch (mm): Circuits: Current (MAX per contact): Voltage: 1. Make your own RAM ® Mount or use RAM ® Mounts components to build a custom mount. XCede connectors also meet higher linear signal density requirements at backplane or midplane interfaces. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1 XCede HD 2 Pair Backplane Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick Wall C-923-201E-500 2 Pair, 8 Column Differential Backplane Module, Thick Wall高速、高密度背板系统包括了各种对数和列数的ExaMAX®和XCede® HD。ExaMAX®可实现高达56 Gbps的性能，并使设计师能够选择优化密度或最大程度地减少电路板层数。XCede® HD是一个采用模块化设计的小型系统，可大幅节省空间并提升灵活性。The XCede ® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. XCede® connectors also address. 2. TARGET MARKETS. Your session is about to timeout due to inactivity. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. This connector ships without wires, terminals and seals. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. Revision SCR No. Amphenol is one of the leading manufacturers of Backplane connectors. Buy Amphenol JX41051436 in Avnet APAC. Commercial Standards 2. Features. DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating interfaces with XCede ® HD and XCede ® HD Plus, this connector provides developers with a readily available robust solution for tighter card. Click to download Certificate of. The XCede ® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 0 specification. 2 The daughtercard connector building blocks include signal modules, power modules, guidance/polarizing modules and grounded guidance modules that are all assembled to a metal organizer (stiffener). Copper Weight and Annular Ring (“A/R”) 8 Table 3: XCede® HD 21. • FCI Product Specfication GS-12-588 (XCede® Connector System) • FCI Repair Manuals (TBD) 4. 2 - One mezzanine card per node, mirrored ; 3 - Two IO Modules per node, mirrored. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. 1K+ bought in past month. 00 mm High-Speed Backplane Cable Socket. The connectors are intermatable, electrically and mechanically interchangeable. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Search for: Search Home; Categories. /PRNewswire/ -- Newark/element14, a leading multi-channel, high-service electronics distributor in the Americas, and a business of global Premier Farnell,. 2-, 3-, 4-, 5-, 6-Pair configurations. XCede® BACKPLANE CONNECTOR SYSTEM DESCRIPTION XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Connectors with six differential pairs per column fit 36 mm minimum card slot pitch and provide 82. 10119128-B0C-40DLF Datasheets | Backplane Connectors - Specialized Connector Header, Male Pins and Blades Through Hole Black XCede®, Guide Left By apogeeweb, 10119128-b0c-40dlf, 10119128-b0c-40dlf datasheet,10119128. XCede. See section 4 regarding XHD2 RAM connectors. 2. Yelp is a fun and easy way to find, recommend and talk about what’s great and not so great in Victoria and beyond. Sloan 2-09-09 “A” S1979 Updated procedure, and addition of RAM and Stacker M. Revision “D” Specification Revision Status . Español $ USD United States. XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 80 mm高密度背板垂直插头. A HIGH-DENSITY, DIFFERENTIAL, LOW-COST CONNECTOR SOLUTION FOR DATA RATES UP TO 14 GBPS. Pitch (mm): Mated Height (mm): Circuits: Current (MAX): 2.